Process for preparing an optical interposer for waveguides
文献类型：专利
| 作者 | BOWEN, TERRY PATRICK; RIETVELD, JAN WILLEM |
| 发表日期 | 2014-08-26 |
| 专利号 | US8818144 |
| 著作权人 | TYCO ELECTRONICS NEDERLAND B.V. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Process for preparing an optical interposer for waveguides |
| 英文摘要 | A process for preparing a subassembly, the process comprising: (a) defining the location of one or more grooves for receiving optical conduits on the top planar surface of a wafer or panel, the grooves corresponding to multiple interposers on the wafer or panel; and (b) etching the grooves into the wafer or panel, each groove having sidewalls and first and second terminal ends and a first facet at each terminal end perpendicular to the side walls, each first facet having a first angle relative to the top planar surface, each groove being shared by a pair of transmitting and receiving interposers on the wafer or panel prior to being diced such that the first and second terminal ends of each groove correspond to transmitting and receiving interposers, respectively. |
| 公开日期 | 2014-08-26 |
| 申请日期 | 2011-01-31 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38541]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TYCO ELECTRONICS NEDERLAND B.V. |
| 推荐引用方式 GB/T 7714 | BOWEN, TERRY PATRICK,RIETVELD, JAN WILLEM. Process for preparing an optical interposer for waveguides. US8818144. 2014-08-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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