Coating method for an optoelectronic chip-on-board module
文献类型：专利
| 作者 | PEIL, MICHAEL; OSWALD, FLORIN; MAIWEG, HARALD |
| 发表日期 | 2015-02-17 |
| 专利号 | US8956922 |
| 著作权人 | HERAEUS NOBLELIGHT GMBH |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Coating method for an optoelectronic chip-on-board module |
| 英文摘要 | A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone. |
| 公开日期 | 2015-02-17 |
| 申请日期 | 2011-08-29 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38567]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HERAEUS NOBLELIGHT GMBH |
| 推荐引用方式 GB/T 7714 | PEIL, MICHAEL,OSWALD, FLORIN,MAIWEG, HARALD. Coating method for an optoelectronic chip-on-board module. US8956922. 2015-02-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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