Molded leadframe for PCB-to-PCB connection
文献类型：专利
| 作者 | SCHUNK, NIKOLAUS W. |
| 发表日期 | 2015-08-11 |
| 专利号 | US9107333 |
| 著作权人 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Molded leadframe for PCB-to-PCB connection |
| 英文摘要 | A method for making a leadframe includes removing a group of parallel, strip-shaped electrical conductors from a metal sheet, embedding end portions of the conductors in molding compound defining a leadframe body, and separating the conductors from each other, such that portions of the conductors remain encapsulated in the molding compound while other portions remain exterior to the molding compound and define leads of the resulting leadframe. |
| 公开日期 | 2015-08-11 |
| 申请日期 | 2014-02-25 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38646]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 推荐引用方式 GB/T 7714 | SCHUNK, NIKOLAUS W.. Molded leadframe for PCB-to-PCB connection. US9107333. 2015-08-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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