Laser die and photonics die package
文献类型：专利
| 作者 | FASANO, BENJAMIN V.; FORTIER, PAUL F. |
| 发表日期 | 2016-06-07 |
| 专利号 | US9360644 |
| 著作权人 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Laser die and photonics die package |
| 英文摘要 | A multi semiconductor device package includes a laser die and a photonics die. The laser die generates light and includes a laser facet that emits light from a light emitting surface. The photonics die modulates light emitted from the laser light emitting surface and includes a device side cavity that exposes an embedded waveguide optically connected with the laser facet. A laser die and photonics die attachment method includes positioning a device side of the laser die relative to a device side of the photonics die, engaging an alignment feature of the photonics die with an alignment feature of the laser die, installing the laser die within a device side recess of photonics die, electrically connecting the laser die with the photonics die, and optically connecting a laser facet of the laser die with an embedded waveguide of the phonics die. |
| 公开日期 | 2016-06-07 |
| 申请日期 | 2014-09-08 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/38660]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 推荐引用方式 GB/T 7714 | FASANO, BENJAMIN V.,FORTIER, PAUL F.. Laser die and photonics die package. US9360644. 2016-06-07. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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