中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Method of fabricating a compound semiconductor device

文献类型:专利

作者YOON, HYUNG-SUP; LEE, JIN-HEE; PARK, BYUNG-SUN; PARK, CHUL-SUN; PYUN, KWANG-EUI
发表日期1999-03-23
专利号US5885847
著作权人ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
国家美国
文献子类授权发明
其他题名Method of fabricating a compound semiconductor device
英文摘要The invention relates to a method of fabricating a compound semiconductor device by forming a first and a second compound semiconductor devices having a plurality of different epitaxial layers on a common semiconductor substrate. The method comprises the steps of sequentially forming a plurality of first epitaxial layers for manufacturing the first compound semiconductor device on the semiconductor substrate; forming a first insulating film pattern for defining an active region of the first compound semiconductor device; etching the plurality of first epitaxial layers using the first insulating film pattern as a mask; forming a second insulating film on the resultant structure; forming a sidewall insulating spacer on the sidewall of the active region of the first compound semiconductor device by dry etching the second insulating film; sequentially forming a plurality of second epitaxial layers for manufacturing the second compound semiconductor device on the portion from which the plurality of first epitaxial layers is etched back; forming each electrode of the first and second compound semiconductor devices; and forming an interconnection electrode interconnecting each electrode of the first and second compound semiconductor devices.
公开日期1999-03-23
申请日期1997-04-11
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/40118]  
专题半导体激光器专利数据库
作者单位ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
推荐引用方式
GB/T 7714
YOON, HYUNG-SUP,LEE, JIN-HEE,PARK, BYUNG-SUN,et al. Method of fabricating a compound semiconductor device. US5885847. 1999-03-23.

入库方式: OAI收割

来源:西安光学精密机械研究所

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