Medium containing optical paths and electrically conducting paths for applications in high speed data links
文献类型：专利
| 作者 | BUDD, RUSSELL A.; CHINIWALLA, PUNIT P.; DOVE, DEREK B.; SANFORD, JAMES L. |
| 发表日期 | 2008-05-06 |
| 专利号 | US7367715 |
| 著作权人 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Medium containing optical paths and electrically conducting paths for applications in high speed data links |
| 英文摘要 | A structure that possesses the combined properties of carrying signals through the provision of a series of electrical conductors, and by optical signals through the intermediary of a series of optical waveguides. This imparts a particular advantage thereto for the fabrication of optical data links, providing a convenient, compact method of interconnecting electrical paths to transducer chips and to waveguide structures. This approach solves the problem of connecting polymer waveguides to VCSEL (Vertical-Cavity-Surface-Emitting Laser) arrays, thereby avoiding the problem of damaging fragile wire bonds. A method is also provided which utilizes the foregoing structure. |
| 公开日期 | 2008-05-06 |
| 申请日期 | 2007-03-22 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/40695]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 推荐引用方式 GB/T 7714 | BUDD, RUSSELL A.,CHINIWALLA, PUNIT P.,DOVE, DEREK B.,et al. Medium containing optical paths and electrically conducting paths for applications in high speed data links. US7367715. 2008-05-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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