VCSEL with at least one through substrate via
文献类型：专利
| 作者 | CHESKIS, DAVID |
| 发表日期 | 2017-07-11 |
| 专利号 | US9705284 |
| 著作权人 | II-VI DELAWARE, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | VCSEL with at least one through substrate via |
| 英文摘要 | In an illustrative embodiment, a VCSEL comprises a substrate, a first DBR on a first major surface of the substrate, an active region on the first DBR, a second DBR on the active region, and electrically conductive vias that pass through the substrate and provide ohmic contact with the DBRs so that electrical connections to both DBRs are available on the substrate side of the VCSEL. The VCSEL is formed by forming a first DBR on a first major surface of a substrate, forming an active region on the first DBR, forming a second DBR on the active region, thinning the substrate, making a first via hole through the substrate to the first DBR, making a second via hole through the substrate and the first DBR, filling the first via hole with an electrically conducting material to contact the first DBR, filling the second via hole with an electrically conducting material, and coupling the second via hole to the second DBR. |
| 公开日期 | 2017-07-11 |
| 申请日期 | 2015-12-03 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/41645]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | II-VI DELAWARE, INC. |
| 推荐引用方式 GB/T 7714 | CHESKIS, DAVID. VCSEL with at least one through substrate via. US9705284. 2017-07-11. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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