Method and apparatus for batch cleaving semiconductor wafers and for coating the cleaved facets
文献类型：专利
| 作者 | BROOM, RONALD F., DR.; GASSER, MARCEL; HARDER, CHRISTOPH, DR.; LATTA, ERNST-EBERHARD, DR.; OOSENBRUG, ALBERTUS; RICHARD, HEINZ; VETTIGER, PETER |
| 发表日期 | 1994-01-26 |
| 专利号 | EP0457998B1 |
| 著作权人 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 国家 | 欧洲专利局 |
| 文献子类 | 授权发明 |
| 其他题名 | Method and apparatus for batch cleaving semiconductor wafers and for coating the cleaved facets |
| 英文摘要 | A method for cleaving semiconductor wafers, or segments thereof, which comprises placing the wafer (11), provided with scribe lines (15) defining the planes where cleaving is to take place, inbetween a pair of flexible transport bands (12,13) and guiding it around a curved, large radius surface (21) thereby applying a bending moment. With a moment of sufficient magnitude, individual bars (22) are broken off the wafer as this is advanced, the bars having front- and rear-end facets. On cleaving, each bar, while still pressed against the curved surface, is automatically separated whereby mutual damage of the facets of neighbouring bars is prevented. For further handling, e.g. for the transport of the bars to an evaporation station for passivation layer deposition, provisions are made to keep the bars separated. Cleaving and the subsequent passivation coating can be carried out in-situ in a vacuum system to prevent facet contamination prior to applying the passivation. |
| 公开日期 | 1994-01-26 |
| 申请日期 | 1990-05-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/41950]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 推荐引用方式 GB/T 7714 | BROOM, RONALD F., DR.,GASSER, MARCEL,HARDER, CHRISTOPH, DR.,et al. Method and apparatus for batch cleaving semiconductor wafers and for coating the cleaved facets. EP0457998B1. 1994-01-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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