Semiconductor laser with encapsulated lead members
文献类型：专利
| 作者 | FUJIMAKI, YOSHITSUGU; NAGASHIMA, KENJI; YOKOYAMA, MORITO; TSUBOI, KUNIO; IMAI, TOSHIHIRO; OGASAWARA, ATSUSHI |
| 发表日期 | 1994-05-03 |
| 专利号 | US5309460 |
| 著作权人 | SONY CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor laser with encapsulated lead members |
| 英文摘要 | A semiconductor laser device is comprised of a first lead member having a mounting portion for mounting a semiconductor laser, at least one second lead member to be connected to the semiconductor laser, and a resin mold member for unitarily molding the first and second lead members, wherein the resin mold member has a recess portion for receiving the semiconductor laser therein and for exposing therein the mounting portion of the first lead member and a part of the second lead member, and wherein the semiconductor laser is electrically connected to the first and second lead members within the recess portion. |
| 公开日期 | 1994-05-03 |
| 申请日期 | 1992-07-15 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/42117]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SONY CORPORATION |
| 推荐引用方式 GB/T 7714 | FUJIMAKI, YOSHITSUGU,NAGASHIMA, KENJI,YOKOYAMA, MORITO,et al. Semiconductor laser with encapsulated lead members. US5309460. 1994-05-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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