Thermal management in packaged VCSELs
文献类型：专利
| 作者 | EID, FERAS; LIFF, SHAWNA M.; BRAUNISCH, HENNING |
| 发表日期 | 2016-07-12 |
| 专利号 | US9391427 |
| 著作权人 | INTEL CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Thermal management in packaged VCSELs |
| 英文摘要 | Heat management systems for vertical cavity surface emitting laser (VCSEL) chips are provided. Embodiments of the invention provide substrates having a vertical cavity surface emitting laser chip disposed on the substrate surface and electrically interconnected with the substrate, a thermal frame disposed on the substrate surface and proximate to at least three sides of the vertical cavity surface emitting laser chip, and a thermal interface material disposed between the at least three sides of the vertical cavity surface emitting laser chip and the thermal frame. The substrate can also include a transceiver chip that is operably coupled to a further integrated circuit chip and that is capable of driving the VCSEL chip. |
| 公开日期 | 2016-07-12 |
| 申请日期 | 2011-11-18 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/42942]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTEL CORPORATION |
| 推荐引用方式 GB/T 7714 | EID, FERAS,LIFF, SHAWNA M.,BRAUNISCH, HENNING. Thermal management in packaged VCSELs. US9391427. 2016-07-12. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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