Integrated VCSELs on traditional VLSI packaging
文献类型：专利
| 作者 | MORRIS, TERREL L. |
| 发表日期 | 2005-12-13 |
| 专利号 | US6975514 |
| 著作权人 | HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Integrated VCSELs on traditional VLSI packaging |
| 英文摘要 | A circuit module including at least one Application Specific Integrated Circuit (ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array modules is built using a standard ceramic or organic VLSI package substrate, resulting is a high density device with a small footprint. Interconnection between the electronic devices and the VCSEL array modules is accomplished using standard integrated circuit packaging technology and flexible connectors. Optical connections from the VCSEL arrays to fiber optic cables are made possible by integrating industry-standard optical connectors onto the package. Optical receiver and transceiver modules may also be incorporated into the circuit module. |
| 公开日期 | 2005-12-13 |
| 申请日期 | 2003-01-31 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/43076]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
| 推荐引用方式 GB/T 7714 | MORRIS, TERREL L.. Integrated VCSELs on traditional VLSI packaging. US6975514. 2005-12-13. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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