TSocket: Thermal Sustainable Power Budgeting
文献类型:期刊论文
作者 | Chen, Guoqing2; Xu, Yi3; Hu, Xing4; Guo, Xiangyang1; Ma, Jun5; Hu, Yu6; Xie, Yuan7 |
刊名 | ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS
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出版日期 | 2016 |
卷号 | 21期号:2页码:22 |
关键词 | Design Management Performance Reliability Power budgeting performance optimization thermal modeling multicore system |
ISSN号 | 1084-4309 |
DOI | 10.1145/2837023 |
英文摘要 | As technology scales, thermal management for multicore architectures becomes a critical challenge due to increasing power density. Existing power budgeting techniques focus on maximizing performance under a given power budget by optimizing the core configurations. In multicore era, a chip-wide power budget, however, is not sufficient to ensure thermal constraints because the thermal sustainable power capacity varies with different threading strategies and core configurations. In this article, we propose two models to dynamically estimate the thermal sustainable power capacity in homogeneous multicore systems: uniform power model and nonuniform power model. These two models convert the thermal effect of threading strategies and core configurations into power capacity, which provide a context-based core power capacity for power budgeting. Based on these models, we introduce a power budgeting framework aiming to improve the performance within thermal constraints, named as TSocket. Compared to the chip-wide power budgeting solution, TSocket shows 19% average performance improvement for the PARSEC benchmarks in single program scenario and up to 11% performance improvement in multiprogram scenario. The performance improvement is achieved by reducing thermal violations and exploring thermal headrooms. |
WOS研究方向 | Computer Science |
语种 | 英语 |
WOS记录号 | WOS:000370550400011 |
出版者 | ASSOC COMPUTING MACHINERY |
源URL | [http://119.78.100.204/handle/2XEOYT63/8775] ![]() |
专题 | 中国科学院计算技术研究所期刊论文_英文 |
通讯作者 | Chen, Guoqing |
作者单位 | 1.N Carolina State Univ, Dept Elect & Comp Engn, Raleigh, NC 27695 USA 2.Adv Micro Devices Inc, AMD Res China Lab, Beijing, Peoples R China 3.Macau Univ Sci & Technol, Space Sci Inst, Macau, Peoples R China 4.Huawei Technol Co Ltd, Shannon Lab, Shenzhen, Peoples R China 5.China Natl Petr Corp, Beijing, Peoples R China 6.Chinese Acad Sci, Inst Comp Technol, Beijing, Peoples R China 7.Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA |
推荐引用方式 GB/T 7714 | Chen, Guoqing,Xu, Yi,Hu, Xing,et al. TSocket: Thermal Sustainable Power Budgeting[J]. ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS,2016,21(2):22. |
APA | Chen, Guoqing.,Xu, Yi.,Hu, Xing.,Guo, Xiangyang.,Ma, Jun.,...&Xie, Yuan.(2016).TSocket: Thermal Sustainable Power Budgeting.ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS,21(2),22. |
MLA | Chen, Guoqing,et al."TSocket: Thermal Sustainable Power Budgeting".ACM TRANSACTIONS ON DESIGN AUTOMATION OF ELECTRONIC SYSTEMS 21.2(2016):22. |
入库方式: OAI收割
来源:计算技术研究所
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