A micromechanical model for deformation behavior of nanocrystalline copper
文献类型：会议论文
| 作者 | Lan JX(兰姣霞) ; Wu YZ(吴永中); Hong YS(洪友士); Lan JX
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| 出版日期 | 2011 |
| 会议名称 | 2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010 |
| 会议日期 | NOV 06-08, 2010 |
| 会议地点 | Shenzhen, China |
| 通讯作者邮箱 | jiaoxia_lan@yahoo.com.cn |
| 关键词 | Algorithms Copper Deformation Grain boundaries Grain size and shape Materials Micromechanics Molecular dynamics Strain energy Deformation behavior Deformation mechanism Developed model Experimental values Grain shapes Grain size Internal variable theory Iteration algorithms Micromechanical model Molecular dynamics simulations Nanocrystalline copper Nanocrystallines Pure copper Statistical distribution Stress strain relation Uniaxial tensions |
| 卷号 | 152-153 |
| 页码 | 772-777 |
| 通讯作者 | Lan JX |
| 中文摘要 | Molecular dynamics simulations have show that nanocrystalline (NC) materials can be treated as composite materials consisting of two phases of grain and grain boundary. In this paper, the incremental stress-strain relation is derived based on deformation mechanism of NC materials and internal variable theory from micromechanics point of view. The developed model is exemplified by the pure copper subjected to uniaxial tension. Implicated iteration algorithm is then employed to obtain the stress-strain relation. Moreover, the effects of grain shape and statistical distribution of grain sizes are also discussed, and predicted results are compared with experimental values to verify the model. |
| 收录类别 | CPCI-S ; EI |
| 合作状况 | 国内 |
| 产权排序 | 1 General Courses Department, Academy of Military Transportation PLA, Tianjin 300161, China 2 China North System Engineering Institute, Beijing 100089, China 3 State Key Laboratory of Nonlinear Mechanics (LNM), Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China |
| 会议网址 | http://dx.doi.org/10.4028/www.scientific.net/AMR.152-153.772 |
| 会议录 | NEW MATERIALS AND ADVANCED MATERIALS
 |
| 会议录出版者 | TRANS TECH PUBLICATIONS, P.O. BOX 1254, CLAUSTHAL-ZELLERFELD, D-38670, GERMANY |
| 语种 | 英语 |
| ISSN号 | 1022-6680 |
| ISBN号 | 9780878492039 |
| WOS记录号 | WOS:000288114200146 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/46819]  |
| 专题 | 力学研究所_非线性力学国家重点实验室 |
| 通讯作者 | Lan JX |
| 推荐引用方式 GB/T 7714 | Lan JX,Wu YZ,Hong YS,et al. A micromechanical model for deformation behavior of nanocrystalline copper[C]. 见:2010 International Conference on Advances in Materials and Manufacturing Processes, ICAMMP 2010. Shenzhen, China. NOV 06-08, 2010.http://dx.doi.org/10.4028/www.scientific.net/AMR.152-153.772. |
入库方式： OAI收割
来源：力学研究所
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