Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints
文献类型：期刊论文
| 作者 | C. Chen ; L. Zhang ; J. X. Zhao ; L. H. Cao ; J. K. Shang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2012 |
| 卷号 | 41期号:9页码:2487-2494 |
| ISSN号 | 0361-5235 |
| 关键词 | Solder size effect shear strength microstructure lead-free solder fatigue-crack initiation sn-ag fe-42ni ni cu |
| 中文摘要 | The effect of the gap size on the shear strength of a solder joint was investigated in both Sn/Cu and Sn/FeNi lap solder joints by varying the gap size from 20 mu m to 300 mu m. In the Sn/FeNi joints, the shear strength remained relatively constant, around 14 MPa, independent of the gap size. In contrast, the shear strength of the Sn/Cu joint decreased about 20% from 25 MPa to 20 MPa. The decrease was shown to result from Cu6Sn5 precipitation in the thicker Sn/Cu joint, which was absent in the thinner joints. |
| 原文出处 | |
| 公开日期 | 2013-02-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/59897]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | C. Chen,L. Zhang,J. X. Zhao,et al. Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints[J]. Journal of Electronic Materials,2012,41(9):2487-2494. |
| APA | C. Chen,L. Zhang,J. X. Zhao,L. H. Cao,&J. K. Shang.(2012).Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints.Journal of Electronic Materials,41(9),2487-2494. |
| MLA | C. Chen,et al."Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints".Journal of Electronic Materials 41.9(2012):2487-2494. |
入库方式： OAI收割
来源：金属研究所
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