Tunable Reactive Wetting of Sn on Microporous Cu Layer
文献类型：期刊论文
| 作者 | Q. Q. Lai ; L. Zhang ; C. Chen ; J. K. Shang |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2012 |
| 卷号 | 28期号:4页码:379-384 |
| 关键词 | Wetting Porous material Soldering copper substrate porous copper infiltration kinetics carbide silicon |
| ISSN号 | 1005-0302 |
| 中文摘要 | Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interfacial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process. |
| 原文出处 | |
| 公开日期 | 2013-02-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/60041]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. Q. Lai,L. Zhang,C. Chen,et al. Tunable Reactive Wetting of Sn on Microporous Cu Layer[J]. Journal of Materials Science & Technology,2012,28(4):379-384. |
| APA | Q. Q. Lai,L. Zhang,C. Chen,&J. K. Shang.(2012).Tunable Reactive Wetting of Sn on Microporous Cu Layer.Journal of Materials Science & Technology,28(4),379-384. |
| MLA | Q. Q. Lai,et al."Tunable Reactive Wetting of Sn on Microporous Cu Layer".Journal of Materials Science & Technology 28.4(2012):379-384. |
入库方式： OAI收割
来源：金属研究所
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