Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
文献类型：期刊论文
| 作者 | M. N. Wang ; J. Q. Wang ; H. Feng ; W. Ke |
| 刊名 | Corrosion Science
 |
| 出版日期 | 2012 |
| 卷号 | 63页码:20-28 |
| 关键词 | Electronic materials Alloy SEM XPS Atmospheric corrosion lead-free solders ag-cu alloys electrochemical corrosion nacl solution tin behavior microstructure surface |
| ISSN号 | 0010-938X |
| 中文摘要 | The aim of this study is to evaluate the effects of Ag3Sn intermetallic compounds (IMCs) on corrosion of Sn-3.0Ag-0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. The Ag3Sn IMCs of SAC305 with various size and morphology were obtained by changing cooling rate. Commercial SAC305 solder with smallest Ag3Sn IMCs exhibits better corrosion resistance than air-cooled and furnace-cooled SAC305 solders because microgalvanic corrosion between large cathodic Ag3Sn IMCs plates and anodic Sn matrix decreased the corrosion resistance of air-cooled and furnace-cooled SAC305 solders. (c) 2012 Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2013-02-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/60298]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | M. N. Wang,J. Q. Wang,H. Feng,et al. Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition[J]. Corrosion Science,2012,63:20-28. |
| APA | M. N. Wang,J. Q. Wang,H. Feng,&W. Ke.(2012).Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition.Corrosion Science,63,20-28. |
| MLA | M. N. Wang,et al."Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition".Corrosion Science 63(2012):20-28. |
入库方式： OAI收割
来源：金属研究所
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