Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder
文献类型：期刊论文
| 作者 | M. N. Wang ; J. Q. Wang ; H. Feng ; W. Ke |
| 刊名 | Journal of Materials Science-Materials in Electronics
 |
| 出版日期 | 2012 |
| 卷号 | 23期号:1页码:148-155 |
| 关键词 | ag-cu alloys electrochemical corrosion buffer solutions nacl solution tin snagcu joints |
| ISSN号 | 0957-4522 |
| 中文摘要 | The heterogeneous microstructure of solder could be obtained when cooling rate of the solder joint was not even, which would affect the corrosion behavior of solder during service. The ambient temperature would also affect the corrosion behavior of solder joint. In this paper, the effects of microstructure and temperature on the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder were investigated. The various microstructures of SAC305 lead-free solder were obtained by cooling specimens in air and furnace. Compared to the fine-fibrous Ag(3)Sn phase inside the commercial SAC305 solder, platelet-like Ag(3)Sn formed as cooling speed decreasing. The polarization behavior of SAC305 solders in 3.5 wt.% NaCl solution was not significantly affected by various microstructures, but sensitive to temperature. |
| 原文出处 | |
| 公开日期 | 2013-02-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/60299]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | M. N. Wang,J. Q. Wang,H. Feng,et al. Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder[J]. Journal of Materials Science-Materials in Electronics,2012,23(1):148-155. |
| APA | M. N. Wang,J. Q. Wang,H. Feng,&W. Ke.(2012).Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder.Journal of Materials Science-Materials in Electronics,23(1),148-155. |
| MLA | M. N. Wang,et al."Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder".Journal of Materials Science-Materials in Electronics 23.1(2012):148-155. |
入库方式： OAI收割
来源：金属研究所
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