Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints
文献类型：期刊论文
| 作者 | L. M. Yang ; Q. K. Zhang ; Z. F. Zhang |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2012 |
| 卷号 | 67期号:7-8页码:637-640 |
| 关键词 | Solder joint Interfaces Intermetallic compounds Fracture Shear strength lead-free solder brazed joints size sn microstructure deformation reliability failure copper cu |
| ISSN号 | 1359-6462 |
| 中文摘要 | Shear fracture behaviors of Cu/Sn-3Cu/Cu joints with different solder dimensions were investigated. The experimental results demonstrate that, with decreasing ratio R of the solder thickness to length, the interfacial shear strength increased and the fracture mode changed from ductile to a mixture of ductile and brittle. Based on the interfacial stress analysis across the solder joint, a hyperbolic formula expressing the relationship between the interfacial shear strength and the ratio R was proposed. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2013-02-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/60394]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | L. M. Yang,Q. K. Zhang,Z. F. Zhang. Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints[J]. Scripta Materialia,2012,67(7-8):637-640. |
| APA | L. M. Yang,Q. K. Zhang,&Z. F. Zhang.(2012).Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints.Scripta Materialia,67(7-8),637-640. |
| MLA | L. M. Yang,et al."Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints".Scripta Materialia 67.7-8(2012):637-640. |
入库方式： OAI收割
来源：金属研究所
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