Correlation between wear resistance and subsurface recrystallization structure in copper
文献类型:期刊论文
作者 | B. Yao ; Z. Han ; K. Lu |
刊名 | Wear
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出版日期 | 2012 |
卷号 | 294页码:438-445 |
关键词 | Sliding wear Hardness Non-ferrous metals Electron microscopy dynamic plastic-deformation thermal-stability microstructural evolution metals alloys cu microhardness friction behavior hardness |
ISSN号 | 0043-1648 |
中文摘要 | Wear of conventional metallic materials involves various complex solid state processes of which the dominant process is elusive. From a thorough experimental investigation on the worn subsurface structure evolution in pure copper specimens with various microstructures, we conclude that the transformation from the subsurface dynamic recrystallization (DRX) structure into the top nanostructured mixing layer (NML) is the most important process which could determine the wear rate. A pronounced correlation is identified that wear rate increases significantly with an increasing grain size or a decreasing hardness of the DRX structure adjacent to the NML This result points out an effective approach to make materials better against wear by stabilizing the deformed structure against DRX. (C) 2012 Elsevier B.V. All rights reserved. |
原文出处 | |
公开日期 | 2013-02-05 |
源URL | [http://ir.imr.ac.cn/handle/321006/60410] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | B. Yao,Z. Han,K. Lu. Correlation between wear resistance and subsurface recrystallization structure in copper[J]. Wear,2012,294:438-445. |
APA | B. Yao,Z. Han,&K. Lu.(2012).Correlation between wear resistance and subsurface recrystallization structure in copper.Wear,294,438-445. |
MLA | B. Yao,et al."Correlation between wear resistance and subsurface recrystallization structure in copper".Wear 294(2012):438-445. |
入库方式: OAI收割
来源:金属研究所
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