Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys
文献类型:期刊论文
作者 | H. F. Zhou ; J. D. Guo ; J. K. Shang |
刊名 | Journal of Electronic Materials
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出版日期 | 2012 |
卷号 | 41期号:11页码:3161-3168 |
关键词 | Electroless Fe-Ni under-bump metallization interfacial reaction lead-free solders wetting balance snagcu solder cu joints solderability growth ag |
ISSN号 | 0361-5235 |
中文摘要 | Interfacial reactions between liquid Sn and electroless xFeNiP alloys (where x is the at.% of Fe) were investigated to determine the suitability of electroless Fe-Ni films as a potential under-bump metallization in solder interconnections. It was found that the interfacial reactions depended strongly on the Fe percentage in the electroless Fe-Ni alloys. The FeSn2 compound layer was observed at the interface of alloys with high atomic percentage of Fe, such as 55 at.% and 75 at.%, while both FeSn2 and Ni3Sn4 layers were found at the interface at low Fe concentration such as 25 at.%. The growth rate of interfacial intermetallic compounds and the amount of intermetallic whiskers grown on the FeNiP coatings decreased with increasing Fe percentage. The presence of FeSn2 phase in Fe-Ni alloys at different Fe concentrations was believed to result from the lower Gibbs free energy for FeSn2 formation in the Sn/FeNiP system, while the variation in the growth rate of the intermetallic layer with Fe concentration was related to the different growth rates of FeSn2 and Ni3Sn4 compounds. |
原文出处 | |
公开日期 | 2013-02-05 |
源URL | [http://ir.imr.ac.cn/handle/321006/60525] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | H. F. Zhou,J. D. Guo,J. K. Shang. Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys[J]. Journal of Electronic Materials,2012,41(11):3161-3168. |
APA | H. F. Zhou,J. D. Guo,&J. K. Shang.(2012).Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys.Journal of Electronic Materials,41(11),3161-3168. |
MLA | H. F. Zhou,et al."Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys".Journal of Electronic Materials 41.11(2012):3161-3168. |
入库方式: OAI收割
来源:金属研究所
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