中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys

文献类型:期刊论文

作者H. F. Zhou ; J. D. Guo ; J. K. Shang
刊名Journal of Electronic Materials
出版日期2012
卷号41期号:11页码:3161-3168
关键词Electroless Fe-Ni under-bump metallization interfacial reaction lead-free solders wetting balance snagcu solder cu joints solderability growth ag
ISSN号0361-5235
中文摘要Interfacial reactions between liquid Sn and electroless xFeNiP alloys (where x is the at.% of Fe) were investigated to determine the suitability of electroless Fe-Ni films as a potential under-bump metallization in solder interconnections. It was found that the interfacial reactions depended strongly on the Fe percentage in the electroless Fe-Ni alloys. The FeSn2 compound layer was observed at the interface of alloys with high atomic percentage of Fe, such as 55 at.% and 75 at.%, while both FeSn2 and Ni3Sn4 layers were found at the interface at low Fe concentration such as 25 at.%. The growth rate of interfacial intermetallic compounds and the amount of intermetallic whiskers grown on the FeNiP coatings decreased with increasing Fe percentage. The presence of FeSn2 phase in Fe-Ni alloys at different Fe concentrations was believed to result from the lower Gibbs free energy for FeSn2 formation in the Sn/FeNiP system, while the variation in the growth rate of the intermetallic layer with Fe concentration was related to the different growth rates of FeSn2 and Ni3Sn4 compounds.
原文出处://WOS:000309677200029
公开日期2013-02-05
源URL[http://ir.imr.ac.cn/handle/321006/60525]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
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H. F. Zhou,J. D. Guo,J. K. Shang. Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys[J]. Journal of Electronic Materials,2012,41(11):3161-3168.
APA H. F. Zhou,J. D. Guo,&J. K. Shang.(2012).Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys.Journal of Electronic Materials,41(11),3161-3168.
MLA H. F. Zhou,et al."Microstructural Study of Interfacial Reactions Between Liquid Sn and Electroless Fe-Ni Alloys".Journal of Electronic Materials 41.11(2012):3161-3168.

入库方式: OAI收割

来源:金属研究所

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