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Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test
文献类型：期刊论文
| 作者 | Y. K. Zhu ; Z. M. Yu ; Y. S. Niu ; W. J. Ding |
| 刊名 | Journal of Adhesion Science and Technology
 |
| 出版日期 | 2012 |
| 卷号 | 26期号:10-11页码:1645-1652 |
| 关键词 | Multilayered Cu coatings adhesion performance bidirectional bend test periodic ultrasonic wave the critical cycle number single |
| ISSN号 | 0169-4243 |
| 中文摘要 | Multilayered Cu coatings were successfully obtained by introducing periodic ultrasonic agitation into an ordinary electroplating process. A so-called bidirectional bending test technique was proposed to assess the adhesive performance of electroplated Cu coatings to a substrate, in which the coated sample was bent in two directions, while the changes in the coating surface were observed. The critical cycle number for the sample, which corresponds to the start of detachment of the coating from the substrate, proved to be suitable for assessing the adhesion. A comparative study showed that the multilayered Cu coatings produced in this work, had much better adhesion than did ordinary Cu coatings. (C) Koninklijke Brill NV, Leiden, 2012 |
| 原文出处 | |
| 公开日期 | 2013-02-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/60542]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Y. K. Zhu,Z. M. Yu,Y. S. Niu,et al. Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test[J]. Journal of Adhesion Science and Technology,2012,26(10-11):1645-1652. |
| APA | Y. K. Zhu,Z. M. Yu,Y. S. Niu,&W. J. Ding.(2012).Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test.Journal of Adhesion Science and Technology,26(10-11),1645-1652. |
| MLA | Y. K. Zhu,et al."Assessment of Adhesion of Electroplated Cu and Multilayered Cu Coatings by a Bidirectional Bend Test".Journal of Adhesion Science and Technology 26.10-11(2012):1645-1652. |
入库方式： OAI收割
来源：金属研究所
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