Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate
文献类型：期刊论文
| 作者 | H. F. Zou ; Q. K. Zhang ; Z. F. Zhang |
| 刊名 | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
 |
| 出版日期 | 2012 |
| 卷号 | 532页码:167-177 |
| 关键词 | Sn-Bi solder Void Cu3Sn Bi segregation Interfacial embrittlement Cu alloys solder interconnect grain-boundaries single-crystal bismuth embrittlement segregation copper strength |
| ISSN号 | 0921-5093 |
| 中文摘要 | It is well known that some discontinuous Bi particles and voids often appear at the interfaces for the SnBi/Cu couples, leading to the interfacial embrittlement during the thermo-aging procedure. In the current study, the experimental results confirmed that Bi segregation at the SnBi/Cu interface mainly originated from the Bi diffusion during reflowing and aging procedure. Small amounts of Ag, Al, Sn or Zn elements were deliberately added into the Cu substrate to restrain the interfacial Bi embrittlement of the SnBi/Cu couples. It does not only restrain the Bi segregation, but also eliminate the formation of voids at the interfaces. Besides, it is interesting to find that the addition of these elements above can significantly improve the mechanical properties of SnBi/Cu alloy joints even after long-term aging. Based on the experimental evidence, it is suggested that alloying Cu substrate is beneficial to the wide application of SnBi and other lead-free solders, and has the potential of being a common substrate in the electronic packaging field in the future. (C) 2011 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2013-02-05 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/60543]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. F. Zou,Q. K. Zhang,Z. F. Zhang. Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2012,532:167-177. |
| APA | H. F. Zou,Q. K. Zhang,&Z. F. Zhang.(2012).Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,532,167-177. |
| MLA | H. F. Zou,et al."Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 532(2012):167-177. |
入库方式： OAI收割
来源：金属研究所
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