Relative Stability of Boiling Electronic Device Coolingng of FC-72 and HFE-7100 with Applications to Electronic Cooling
文献类型：期刊论文
| 作者 | Z. W. LIU ; W. W. LIN ; D. J. LEE1 ; X. F. PENG2 |
| 刊名 | JOURNAL OF THERMAL SCIENCE
 |
| 出版日期 | 2000 |
| 卷号 | 9期号:4页码:352，355 |
| 关键词 | boiling relative stability FC-72 HFE-7100 subcooling. |
| 公开日期 | 2013-03-12 |
| 源URL | [http://ir.etp.ac.cn/handle/311046/53866]  |
| 专题 | 工程热物理研究所_Journal of Thermal Science_期刊论文 |
| 推荐引用方式 GB/T 7714 | Z. W. LIU,W. W. LIN,D. J. LEE1,et al. Relative Stability of Boiling Electronic Device Coolingng of FC-72 and HFE-7100 with Applications to Electronic Cooling[J]. JOURNAL OF THERMAL SCIENCE,2000,9(4):352，355. |
| APA | Z. W. LIU,W. W. LIN,D. J. LEE1,&X. F. PENG2.(2000).Relative Stability of Boiling Electronic Device Coolingng of FC-72 and HFE-7100 with Applications to Electronic Cooling.JOURNAL OF THERMAL SCIENCE,9(4),352，355. |
| MLA | Z. W. LIU,et al."Relative Stability of Boiling Electronic Device Coolingng of FC-72 and HFE-7100 with Applications to Electronic Cooling".JOURNAL OF THERMAL SCIENCE 9.4(2000):352，355. |
入库方式： OAI收割
来源：工程热物理研究所
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