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Study on experiment of grinding SiC mirror with fixed abrasive (EI CONFERENCE)

文献类型：会议论文

作者Wang X.; Zhang X.-J.; Wang X.; Wang X.
出版日期2009
会议名称4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, November 19, 2008 - November 21, 2008
会议地点Chengdu, China
关键词A brand-new technology for manufacturing SiC reflecting mirror that is different from the traditional method is adopted which is called as fixed abrasive surfacing technology. Not only the new method achieves better mirror quality with bigger diamond in diameter quickly but also because of the fixed motion between the abrasive and workpiece and it will be good for surface finishing. During experiment material removal characteristic which is on SiC under certain rotation speed and pressure by W7 W5 W3.5 W1.5 pellets has been tested. Through those removal curves we come to a conclusion that the technology not only has a higher removal rate but also has much more stability. In addition the surface roughness experiment is mentioned. In the first stage we achieved a mirror with surface roughness 42.758nm rms with W7 pellets. The surface roughness is descending as we change pellets with smaller diamond in diameter . At the end of experiment a smooth surface with roughness 1.591nm rms has been achieved after using W1.5 pellets. Experiment results indicate that the technology which manufactures SiC reflecting mirror with fixed abrasive is able to replace the traditional slurry abrasive completely in certain finishing phase and also has a great foreground in application. 2009 SPIE.
收录类别EI
源URL[http://ir.ciomp.ac.cn/handle/181722/33856]  
专题长春光学精密机械与物理研究所_中科院长春光机所知识产出_会议论文
推荐引用方式
GB/T 7714		 Wang X.,Zhang X.-J.,Wang X.,et al. Study on experiment of grinding SiC mirror with fixed abrasive (EI CONFERENCE)[C]. 见:4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, November 19, 2008 - November 21, 2008. Chengdu, China.

入库方式： OAI收割

来源：长春光学精密机械与物理研究所

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