Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization
文献类型：期刊论文
| 作者 | Wang, DL ; Yuan, Y ; Luo, L |
| 刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| 出版日期 | 2012 |
| 卷号 | 23期号:1页码:61-67 |
| ISSN号 | 0957-4522 |
| 通讯作者 | Luo, L (reprint author), Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China. |
| 中文摘要 | Intermetallic compounds formed during the liquid-solid interfacial reaction of Sn-Ag and Sn-Ag-In solder bumps on Cu under bump metallization at temperatures ranging from 240 to 300 A degrees C were investigated. Two types of intermetallic compounds layer |
| 学科主题 | Engineering; Materials Science; Physics |
| 原文出处 | 10.1007/s10854-011-0414-x |
| 公开日期 | 2013-04-25 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/115075]  |
| 专题 | 上海微系统与信息技术研究所_无线、宽带、通讯技术_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wang, DL,Yuan, Y,Luo, L. Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2012,23(1):61-67. |
| APA | Wang, DL,Yuan, Y,&Luo, L.(2012).Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,23(1),61-67. |
| MLA | Wang, DL,et al."Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 23.1(2012):61-67. |
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