中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Tandem electroabsorption modulators integrated with DFB laser by ultra-low-pressure selective-area-growth MOCVD for 10 GHz optical short pulse generation

文献类型:期刊论文

作者Zhao, Q ; Pan, JQ ; Zhang, J ; Zhou, GT ; Wu, J ; Wang, LF ; Wang, W
刊名semiconductor science and technology
出版日期2005
卷号20期号:8页码:882-885
关键词摘要: A novel device of tandem MQW EAMs monolithically integrated with a DFB laser is fabricated by an ultra-low-pressure (22 mbar) selective area growth MOCVD technique. Experimental results exhibit superior device characteristics with low threshold of 19 mA output light power of 4.5 mW and over 20 dB extinction ratio when coupled to a single mode fibre. Moreover over 10 GHz modulation bandwidth is developed with a driving voltage of 2 V. Using this sinusoidal voltage driven integrated device 10 GHz repetition rate pulse with an actual width of 13.7 ps without any compression elements is obtained.
ISSN号0268-1242
通讯作者zhao, q, chinese acad sci, inst semicond, natl res ctr optoelect technol, pob 912, beijing 100083, peoples r china. 电子邮箱地址: qzhao@red.semi.ac.cn
中文摘要 
学科主题光电子学
收录类别SCI
语种英语
公开日期2010-03-17
源URL[http://ir.semi.ac.cn/handle/172111/8540]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Zhao, Q,Pan, JQ,Zhang, J,et al. Tandem electroabsorption modulators integrated with DFB laser by ultra-low-pressure selective-area-growth MOCVD for 10 GHz optical short pulse generation[J]. semiconductor science and technology,2005,20(8):882-885.
APA Zhao, Q.,Pan, JQ.,Zhang, J.,Zhou, GT.,Wu, J.,...&Wang, W.(2005).Tandem electroabsorption modulators integrated with DFB laser by ultra-low-pressure selective-area-growth MOCVD for 10 GHz optical short pulse generation.semiconductor science and technology,20(8),882-885.
MLA Zhao, Q,et al."Tandem electroabsorption modulators integrated with DFB laser by ultra-low-pressure selective-area-growth MOCVD for 10 GHz optical short pulse generation".semiconductor science and technology 20.8(2005):882-885.

入库方式: OAI收割

来源:半导体研究所

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