中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Temperature dependence of absorption edge in MOCVD grown GaN

文献类型:期刊论文

作者Majid A (Majid Abdul) ; Ali A (Ali Akbar) ; Zhu JJ (Zhu Jianjun)
刊名journal of materials science-materials in electronics
出版日期2007
卷号18期号:12页码:1229-1233
ISSN号issn: 0957-4522
关键词CHEMICAL-VAPOR-DEPOSITION
通讯作者ali, a, quaid i azam univ, dept phys, adv mat phys lab, islamabad, pakistan. 电子邮箱地址: aarandhawa@yahoo.com
中文摘要we have studied the temperature dependence of absorption edge of gan thin films grown on sapphire substrate by metal-organic chemical vapor deposition using optical absorption spectroscopy. a shift in absorption edge of about 55 mev has been observed in temperature range 273-343 k. we have proposed a theoretical model to find the energy gap from absorption coefficient using alpha = alpha(max) + (alpha(min) - alpha(max))/[1 + exp 2(e - e-g + kt)/kt]. temperature dependence of band gap has also been studied by finding an appropriate theoretical fit to our data using e-g(t) = e-g(273 k) - (8.8 x 10(-4)t(2))/(483 + t) + 0.088 (varshni empirical formula) and e-g(t) = e-g(273 k)-0.231447/[exp(362/t)-1] + 0.082 relations. it has been found that data can be fitted accurately after adding a factor similar to 0.08 in above equations. debye temperature (483 k) and einstein temperature (362 k) in the respective equations are found mutually in good agreement.
学科主题光电子学
收录类别SCI
语种英语
公开日期2010-03-29
源URL[http://ir.semi.ac.cn/handle/172111/9286]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
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Majid A ,Ali A ,Zhu JJ . Temperature dependence of absorption edge in MOCVD grown GaN[J]. journal of materials science-materials in electronics,2007,18(12):1229-1233.
APA Majid A ,Ali A ,&Zhu JJ .(2007).Temperature dependence of absorption edge in MOCVD grown GaN.journal of materials science-materials in electronics,18(12),1229-1233.
MLA Majid A ,et al."Temperature dependence of absorption edge in MOCVD grown GaN".journal of materials science-materials in electronics 18.12(2007):1229-1233.

入库方式: OAI收割

来源:半导体研究所

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