Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices
文献类型:期刊论文
作者 | Yang, H (Yang, H.) ; Zhu, HL (Zhu, H. L.) ; Xie, HY (Xie, H. Y.) ; Zhao, LJ (Zhao, L. J.) ; Zhou, F (Zhou, F.) ; Wang, W (Wang, W.) |
刊名 | ieee transactions on advanced packaging
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出版日期 | 2007 |
卷号 | 30期号:1页码:34-37 |
关键词 | coplanar waveguide (CPW) |
ISSN号 | issn: 1521-3323 |
通讯作者 | yang, h, nanyang technol univ, singapore 639798, singapore. |
中文摘要 | coupling and packaging have become decisive factors in the final performance and cost of high-frequency optoelectronic devices. here, we report the design and successful fabrication of a silicon bench that integrates a v-groove and high-frequency coplanar waveguide (cpw) on the same high-resistivity silicon wafer as an effective optoelectronic packaging solution. |
学科主题 | 光电子学 |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2010-03-29 |
源URL | [http://ir.semi.ac.cn/handle/172111/9642] ![]() |
专题 | 半导体研究所_中国科学院半导体研究所(2009年前) |
推荐引用方式 GB/T 7714 | Yang, H ,Zhu, HL ,Xie, HY ,et al. Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices[J]. ieee transactions on advanced packaging,2007,30(1):34-37. |
APA | Yang, H ,Zhu, HL ,Xie, HY ,Zhao, LJ ,Zhou, F ,&Wang, W .(2007).Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices.ieee transactions on advanced packaging,30(1),34-37. |
MLA | Yang, H ,et al."Silicon bench for passive coupling and packaging of high-frequency optoelectronic devices".ieee transactions on advanced packaging 30.1(2007):34-37. |
入库方式: OAI收割
来源:半导体研究所
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