Characterization of parasitics in TO-packaged high-speed laser modules
文献类型：期刊论文
| 作者 | Chen C (Chen Cheng) ; Zhu NH (Zhu Ning Hua) ; Zhang SJ (Zhang Shang Jian) ; Liu Y (Liu Yu) |
| 刊名 | ieee transactions on advanced packaging
 |
| 出版日期 | 2007 |
| 卷号 | 30期号:1页码:97-103 |
| 关键词 | equivalent circuits |
| ISSN号 | issn: 1521-3323 |
| 通讯作者 | chen, c, chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china. |
| 中文摘要 | an elaborate analysis of the parasitic network of high-speed through-hole packaging (to)-type laser modules is presented using a small-signal equivalent circuit model. the intrinsic laser diode is obtained using the optical modulation technique, and is embedded into the model as a separate component. three step-by-step measurements are made for determining the packaging parasitic network, including the test fixture, to header, submount, bonding wire, and parasitics of the laser chip. a good agreement between simulated and measured results confirms the validation and accuracy of the characterization procedures. furthermore, several key parasitic elements are found based on the simulation of the high-frequency responses of the packaged devices. it is expected that the 3-db bandwidth of 12 ghz or more of the low-cost to packaged laser module may be achieved using the proposed optimization method. |
| 学科主题 | 光电子学 |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2010-03-29 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/9644]  |
| 专题 | 半导体研究所_中国科学院半导体研究所（2009年前） |
| 推荐引用方式 GB/T 7714 | Chen C ,Zhu NH ,Zhang SJ ,et al. Characterization of parasitics in TO-packaged high-speed laser modules[J]. ieee transactions on advanced packaging,2007,30(1):97-103. |
| APA | Chen C ,Zhu NH ,Zhang SJ ,&Liu Y .(2007).Characterization of parasitics in TO-packaged high-speed laser modules.ieee transactions on advanced packaging,30(1),97-103. |
| MLA | Chen C ,et al."Characterization of parasitics in TO-packaged high-speed laser modules".ieee transactions on advanced packaging 30.1(2007):97-103. |
入库方式： OAI收割
来源：半导体研究所
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