Self-assembling of submicrometer three-dimensional photonic crystals in concave microzones etched on silicon substrates
文献类型：期刊论文
| 作者 | Ye ZC (Ye Zhicheng) ; Han PD (Han Peide) ; Zhao CH (Zhao Chunhua) ; Quan YJ (Quan Yujun) ; Lu XD (Lu Xiaodong) ; Wu L (Wu Li) |
| 刊名 | journal of the optical society of america a-optics image science and vision
 |
| 出版日期 | 2007 |
| 卷号 | 24期号:1页码:231-235 |
| 关键词 | LIGHT |
| ISSN号 | issn: 1084-7529 |
| 通讯作者 | ye, zc, chinese acad sci, inst semicond, qinghua e rd jia 35, beijing 100083, peoples r china. 电子邮箱地址: yzhch@red.semi.ac.cn |
| 中文摘要 | by vertical sedimentation and oblique titration, silica microspheres were grown in different shapes of concave microzones that were etched on a (100) p-silicon substrate. through scanning electron microscope observation and optical reflective spectra measurement, sedimentation of microspheres in those microzones was compared. an index was introduced to judge the efficiency of sedimentation. the comparison demonstrates that regular hexagons and triangles facilitate the growth of photonic crystals the most. (c) 2006 optical society of america |
| 学科主题 | 光电子学 |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2010-03-29 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/9738]  |
| 专题 | 半导体研究所_中国科学院半导体研究所（2009年前） |
| 推荐引用方式 GB/T 7714 | Ye ZC ,Han PD ,Zhao CH ,et al. Self-assembling of submicrometer three-dimensional photonic crystals in concave microzones etched on silicon substrates[J]. journal of the optical society of america a-optics image science and vision,2007,24(1):231-235. |
| APA | Ye ZC ,Han PD ,Zhao CH ,Quan YJ ,Lu XD ,&Wu L .(2007).Self-assembling of submicrometer three-dimensional photonic crystals in concave microzones etched on silicon substrates.journal of the optical society of america a-optics image science and vision,24(1),231-235. |
| MLA | Ye ZC ,et al."Self-assembling of submicrometer three-dimensional photonic crystals in concave microzones etched on silicon substrates".journal of the optical society of america a-optics image science and vision 24.1(2007):231-235. |
入库方式： OAI收割
来源：半导体研究所
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