中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
The effects of LT AlN buffer thickness on the properties of high Al composition AlGaN epilayers

文献类型:期刊论文

作者Wang XL (Wang X. L.) ; Zhao DG (Zhao D. G.) ; Li XY (Li X. Y.) ; Gong HM (Gong H. M.) ; Yang H (Yang H.) ; Liang JW (Liang J. W.)
刊名materials letters
出版日期2006
卷号60期号:29-30页码:3693-3696
ISSN号0167-577x
关键词AlGaN LT AlN TAXRD dislocation
通讯作者wang, xl, chinese acad sci, inst semicond, state key lab integrated optoelect, pob 912, beijing 100083, peoples r china. e-mail: wxl@mail.semi.ac.cn
中文摘要to fabricate nitride-based ultraviolet optoelectronic devices, a deposition process for high-al-composition algan (al content > 50%) films with reduced dislocation densities must be developed. this paper describes the growth of high-al-composition algan film on (0001) sapphire via a lt ain nucleation layer by low pressure metalorganic chemical vapor deposition (lpmocvd). the influence of the low temperature ain buffer layer thickness on the high-al-content algan epilayer is investigated by triple-axis x-ray diffraction (taxrd), scanning electron microscopy (sem), and optical transmittance. the results show that the buffer thickness is a key parameter that affects the quality of the algan epilayer. an appropriate thickness results in the best structural properties and surface morphology. (c) 2006 elsevier b.v. all rights reserved.
学科主题光电子学
收录类别SCI
语种英语
公开日期2010-04-11
源URL[http://ir.semi.ac.cn/handle/172111/10248]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Wang XL ,Zhao DG ,Li XY ,et al. The effects of LT AlN buffer thickness on the properties of high Al composition AlGaN epilayers[J]. materials letters,2006,60(29-30):3693-3696.
APA Wang XL ,Zhao DG ,Li XY ,Gong HM ,Yang H ,&Liang JW .(2006).The effects of LT AlN buffer thickness on the properties of high Al composition AlGaN epilayers.materials letters,60(29-30),3693-3696.
MLA Wang XL ,et al."The effects of LT AlN buffer thickness on the properties of high Al composition AlGaN epilayers".materials letters 60.29-30(2006):3693-3696.

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来源:半导体研究所

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