中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules

文献类型:期刊论文

作者Zhang SJ (Zhang S. J.) ; Zhu NH (Zhu N. H.) ; Liu Y (Liu Y.) ; Xie L (Xie L.)
刊名optical and quantum electronics
出版日期2006
卷号38期号:8页码:675-682
关键词packaging photodiode photodiode module scattering parameters measurement LASER
ISSN号0306-8919
通讯作者zhu, nh, chinese acad sci, inst semicond, state key lab integrated optoelect, pob 912, beijing 100083, peoples r china. e-mail: nhzhu@red.semi.ac.cn
中文摘要scattering parameters of photodiode chip, to header and to packaged module are measured, and the effects of to packaging network on the high-frequency response of photodiode are investigated. based on the analysis, the potential bandwidth of to packaging techniques is estimated from the scattering parameters of the to packaging network. another method for estimating the potential bandwidth from the equivalent circuit for the to packaged photodiode model is also presented. the results obtained using both methods show that the to packaging techniques used in the experiments can potentially achieve a frequency bandwidth of 22 ghz.
学科主题光电子学
收录类别SCI
语种英语
公开日期2010-04-11
源URL[http://ir.semi.ac.cn/handle/172111/10332]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Zhang SJ ,Zhu NH ,Liu Y ,et al. Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules[J]. optical and quantum electronics,2006,38(8):675-682.
APA Zhang SJ ,Zhu NH ,Liu Y ,&Xie L .(2006).Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules.optical and quantum electronics,38(8),675-682.
MLA Zhang SJ ,et al."Potential frequency bandwidth estimation of TO packaging techniques for photodiode modules".optical and quantum electronics 38.8(2006):675-682.

入库方式: OAI收割

来源:半导体研究所

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