中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Raman scattering detection of stacking faults in free-standing cubic-SiC epilayer

文献类型:期刊论文

作者Liu XF (Liu Xing-Fang) ; Sun GS (Sun Guo-Sheng) ; Li JM (Li Jin-Min) ; Zhao YM (Zhao Yong-Mei) ; Li JY (Li Jia-Ye) ; Wang L (Wang Lei) ; Zhao WS (Zhao Wan-Shun) ; Zeng YP (Zeng Yi-Ping)
刊名chinese physics letters
出版日期2006
卷号23期号:10页码:2834-2837
ISSN号0256-307x
关键词SPECTROSCOPY GROWTH POLYTYPES SILICON
通讯作者liu, xf, chinese acad sci, inst semicond, novel semicond mat lab, beijing 100083, peoples r china. e-mail: liuxf@mail.semi.ac.cn
中文摘要we report on stacking fault (sf) detection in free-standing cubic-sic epilayer by the raman measurements. the epilayer with enhanced sfs is heteroepitaxially grown by low pressure chemical vapour deposition on a si(100) substrate and is released in koh solution by micromechanical manufacture, on which the raman measurements are performed in a back scattering geometry. the to line of the raman spectra is considerably broadened and distorted. we discuss the influence of sfs on the intensity profiles of to mode by comparing our experimental data with the simulated results based on the raman bond polarizability (bp) model in the framework of linear-chain concept. good agreement with respect to the linewidth and disorder-induced peak shift is found by assuming the mean distance of the sfs to be 11 angstrom in the bp model.
学科主题半导体材料
收录类别SCI
语种英语
公开日期2010-04-11
源URL[http://ir.semi.ac.cn/handle/172111/10366]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Liu XF ,Sun GS ,Li JM ,et al. Raman scattering detection of stacking faults in free-standing cubic-SiC epilayer[J]. chinese physics letters,2006,23(10):2834-2837.
APA Liu XF .,Sun GS .,Li JM .,Zhao YM .,Li JY .,...&Zeng YP .(2006).Raman scattering detection of stacking faults in free-standing cubic-SiC epilayer.chinese physics letters,23(10),2834-2837.
MLA Liu XF ,et al."Raman scattering detection of stacking faults in free-standing cubic-SiC epilayer".chinese physics letters 23.10(2006):2834-2837.

入库方式: OAI收割

来源:半导体研究所

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