中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Morphological defects and uniformity issues of 4H-SiC homoepitaxial layers grown on off-oriented (0001)Si faces

文献类型:期刊论文

作者Sun GS (Sun G. S.) ; Liu XF (Liu X. F.) ; Gong QC (Gong Q. C.) ; Wang L (Wang L.) ; Zhao WS (Zhao W. S.) ; Li JY (Li J. Y.) ; Zeng YP (Zeng Y. P.) ; Li JM (Li J. M.)
刊名materials science in semiconductor processing
出版日期2006
卷号9期号:1-3页码:275-278
ISSN号1369-8001
关键词4H-SiC homoepitaxial layers surface morphological defect optical microscopy SILICON-CARBIDE DISLOCATIONS FILMS
通讯作者sun, gs, chinese acad sci, inst semicond, beijing 100083, peoples r china. e-mail: gshsun@red.semi.ac.cn
中文摘要the morphological defects and uniformity of 4h-sic epilayers grown by hot wall cvd at 1500 degrees c on off-oriented (0001) si faces are characterized by atomic force microscope, nomarski optical microscopy, and micro-raman spectroscopy. typical morphological defects including triangular defects, wavy steps, round pits, and groove defects are observed in mirror-like sic epilayers. the preparation of the substrate surface is necessary for the growth of high-quality 4h-sic epitaxial layers with low-surface defect density under optimized growth conditions. (c) 2006 elsevier ltd. all rights reserved.
学科主题半导体材料
收录类别SCI
语种英语
公开日期2010-04-11
源URL[http://ir.semi.ac.cn/handle/172111/10538]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Sun GS ,Liu XF ,Gong QC ,et al. Morphological defects and uniformity issues of 4H-SiC homoepitaxial layers grown on off-oriented (0001)Si faces[J]. materials science in semiconductor processing,2006,9(1-3):275-278.
APA Sun GS .,Liu XF .,Gong QC .,Wang L .,Zhao WS .,...&Li JM .(2006).Morphological defects and uniformity issues of 4H-SiC homoepitaxial layers grown on off-oriented (0001)Si faces.materials science in semiconductor processing,9(1-3),275-278.
MLA Sun GS ,et al."Morphological defects and uniformity issues of 4H-SiC homoepitaxial layers grown on off-oriented (0001)Si faces".materials science in semiconductor processing 9.1-3(2006):275-278.

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来源:半导体研究所

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