中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Influence of ion energy and deposition temperature on the surface morphology of carbon films deposited by ion beams

文献类型:期刊论文

作者Liao MY ; Qin FG ; Chai CL ; Liu ZK ; Yang SY ; Yao ZY ; Wang ZG
刊名acta physica sinica
出版日期2001
卷号50期号:7页码:1324-1328
关键词amorphous carbon surface morphology mass-selected low energy ion beam deposition TETRAHEDRAL AMORPHOUS-CARBON BIAS-ENHANCED NUCLEATION ATOMIC-FORCE MICROSCOPY DIAMOND-LIKE CARBON SILICON GROWTH MODEL
ISSN号1000-3290
通讯作者liao my,chinese acad sci,inst semicond,lab semicond mat sci,beijing 100083,peoples r china.
中文摘要carbon films were deposited by mass-selected ion beam technique with ion energies 50-200ev at a substrate temperature from room temperature to 80 degreesc,. for the energies used, smooth diamond-like carbon films were deposited at room temperature. when the substrate temperature was 600 degreesc,rough graphitic films were produced. but highly oriented carbon tubes were observed when the energies were larger than 140ev at 800 degreesc. they were perpendicular to the surface and parallel to each other. preferred orientation of graphite basic plane was observed by high-resolution electron microscopy. shallow ion implantation and stress are responsible for this orientation.
学科主题半导体物理
收录类别SCI
语种中文
公开日期2010-08-12
源URL[http://ir.semi.ac.cn/handle/172111/12148]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Liao MY,Qin FG,Chai CL,et al. Influence of ion energy and deposition temperature on the surface morphology of carbon films deposited by ion beams[J]. acta physica sinica,2001,50(7):1324-1328.
APA Liao MY.,Qin FG.,Chai CL.,Liu ZK.,Yang SY.,...&Wang ZG.(2001).Influence of ion energy and deposition temperature on the surface morphology of carbon films deposited by ion beams.acta physica sinica,50(7),1324-1328.
MLA Liao MY,et al."Influence of ion energy and deposition temperature on the surface morphology of carbon films deposited by ion beams".acta physica sinica 50.7(2001):1324-1328.

入库方式: OAI收割

来源:半导体研究所

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