Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels
文献类型：期刊论文
| 作者 | Chen HD ; Liang K ; Zeng QM ; Li XJ ; Chen ZB ; Du Y ; Wu RH |
| 刊名 | iee proceedings-optoelectronics
 |
| 出版日期 | 2000 |
| 卷号 | 147期号:1页码:2-6 |
| ISSN号 | 1350-2433 |
| 关键词 | MQW MODULATORS EFFECT DEVICE PROGRESS CIRCUITS CMOS |
| 通讯作者 | chen hd,chinese acad sci,inst semicond,state key lab integrated optoelect,beijing 100083,peoples r china. |
| 中文摘要 | hybrid integration of gaas/algaas multiple quantum well self electro-optic effect device (seed) arrays are demonstrated flip-chip bonded directly onto 1 mu m silicon cmos circuits. the gaas/algaas mqw devices are designed for 850 nm operation. some devices are used as input light detectors and others serve as output light modulators. the measurement results under applied biases show good optoelectronic characteristics of elements in seed arrays. nearly the same reflection spectrum is obtained for the different devices at an array and the contrast ratio is more than 1.2:1 after flip-chip bonding and packaging. the transimpedance receiver-transmitter circuit can be operated at a frequency of 300 mhz. |
| 学科主题 | 光电子学 |
| 收录类别 | SCI |
| 语种 | 英语 |
| 公开日期 | 2010-08-12 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/12612]  |
| 专题 | 半导体研究所_中国科学院半导体研究所（2009年前） |
| 推荐引用方式 GB/T 7714 | Chen HD,Liang K,Zeng QM,et al. Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels[J]. iee proceedings-optoelectronics,2000,147(1):2-6. |
| APA | Chen HD.,Liang K.,Zeng QM.,Li XJ.,Chen ZB.,...&Wu RH.(2000).Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels.iee proceedings-optoelectronics,147(1),2-6. |
| MLA | Chen HD,et al."Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels".iee proceedings-optoelectronics 147.1(2000):2-6. |
入库方式： OAI收割
来源：半导体研究所
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