Improvement of thin silicon on sapphire (SOS) film materials and device performances by solid phase epitaxy
文献类型:期刊论文
作者 | Yu F![]() |
刊名 | materials science and engineering b-solid state materials for advanced technology
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出版日期 | 2000 |
卷号 | 72期号:2-3页码:189-192 |
关键词 | solid phase epitaxy silicon on sapphire (SOS) carrier mobility |
ISSN号 | 0921-5107 |
通讯作者 | wang qy,chinese acad sci,inst semicond,beijing 100083,peoples r china. |
中文摘要 | the increased emphasis on sub-micron cmos/sos devices has placed a demand for high quality thin silicon on sapphire (sos) films with thickness of the order 100-200 nm. it is demonstrated that the crystalline quality of as-grown thin sos films by the cvd method can be greatly improved by solid phase epitaxy (spe) process: implantation of self-silicon ions and subsequent thermal annealing. subsequent regrowth of this amorphous layer leads to a greater improvement in silicon layer crystallinity and channel carrier mobility, evidenced, respectively, by double crystal x-ray diffraction and electrical measurements. we concluded that the thin spe sos films are suitable for application to high-performance cmos circuitry. (c) 2000 elsevier science s.a. all rights reserved. |
学科主题 | 半导体材料 |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2010-08-12 |
源URL | [http://ir.semi.ac.cn/handle/172111/12648] ![]() |
专题 | 半导体研究所_中国科学院半导体研究所(2009年前) |
推荐引用方式 GB/T 7714 | Yu F. Improvement of thin silicon on sapphire (SOS) film materials and device performances by solid phase epitaxy[J]. materials science and engineering b-solid state materials for advanced technology,2000,72(2-3):189-192. |
APA | Yu F.(2000).Improvement of thin silicon on sapphire (SOS) film materials and device performances by solid phase epitaxy.materials science and engineering b-solid state materials for advanced technology,72(2-3),189-192. |
MLA | Yu F."Improvement of thin silicon on sapphire (SOS) film materials and device performances by solid phase epitaxy".materials science and engineering b-solid state materials for advanced technology 72.2-3(2000):189-192. |
入库方式: OAI收割
来源:半导体研究所
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