中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Improvement of thin silicon on sapphire (SOS) film materials and device performances by solid phase epitaxy

文献类型:期刊论文

作者Yu F
刊名materials science and engineering b-solid state materials for advanced technology
出版日期2000
卷号72期号:2-3页码:189-192
关键词solid phase epitaxy silicon on sapphire (SOS) carrier mobility
ISSN号0921-5107
通讯作者wang qy,chinese acad sci,inst semicond,beijing 100083,peoples r china.
中文摘要the increased emphasis on sub-micron cmos/sos devices has placed a demand for high quality thin silicon on sapphire (sos) films with thickness of the order 100-200 nm. it is demonstrated that the crystalline quality of as-grown thin sos films by the cvd method can be greatly improved by solid phase epitaxy (spe) process: implantation of self-silicon ions and subsequent thermal annealing. subsequent regrowth of this amorphous layer leads to a greater improvement in silicon layer crystallinity and channel carrier mobility, evidenced, respectively, by double crystal x-ray diffraction and electrical measurements. we concluded that the thin spe sos films are suitable for application to high-performance cmos circuitry. (c) 2000 elsevier science s.a. all rights reserved.
学科主题半导体材料
收录类别SCI
语种英语
公开日期2010-08-12
源URL[http://ir.semi.ac.cn/handle/172111/12648]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Yu F. Improvement of thin silicon on sapphire (SOS) film materials and device performances by solid phase epitaxy[J]. materials science and engineering b-solid state materials for advanced technology,2000,72(2-3):189-192.
APA Yu F.(2000).Improvement of thin silicon on sapphire (SOS) film materials and device performances by solid phase epitaxy.materials science and engineering b-solid state materials for advanced technology,72(2-3),189-192.
MLA Yu F."Improvement of thin silicon on sapphire (SOS) film materials and device performances by solid phase epitaxy".materials science and engineering b-solid state materials for advanced technology 72.2-3(2000):189-192.

入库方式: OAI收割

来源:半导体研究所

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