中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Fracture properties of silicon carbide thin films charcterized by bulge test of long membranes

文献类型:会议论文

作者Zhou, W ; Yang, JL ; Sun, GS ; Liu, XF ; Yang, FH ; Li, JM
出版日期2008
会议名称3rd ieee international conference of nano/micro engineered and molecular systems
会议日期jan 06-09, 2008
会议地点sanya, peoples r china
关键词bulge test fracture property silicon carbide thin films Weibull distribution function
页码vols 1-3: 530-533
通讯作者zhou, w, cas, inst semicond, beijing 100864, peoples r china.
中文摘要the mechanical properties and fracture behavior of silicon carbide (3c-sic) thin films grown on silicon substrates were characterized using bulge testing combined with a refined load-deflection model for long rectangular membranes. plane-strain modulus e-ps, prestress so, and fracture strength s(max) for 3c-sic thin films with thickness of 0.40 mu m and 1.42 mu m were extracted. the e, values of sic are strongly dependent on grain orientation. the thicker sic film presents lower so than the thinner film due to stress relaxation. the s(max) values decrease with increasing film thickness. the statistical analysis of the fracture strength data were achieved by weibull distribution function and the fracture origins were predicted.
英文摘要the mechanical properties and fracture behavior of silicon carbide (3c-sic) thin films grown on silicon substrates were characterized using bulge testing combined with a refined load-deflection model for long rectangular membranes. plane-strain modulus e-ps, prestress so, and fracture strength s(max) for 3c-sic thin films with thickness of 0.40 mu m and 1.42 mu m were extracted. the e, values of sic are strongly dependent on grain orientation. the thicker sic film presents lower so than the thinner film due to stress relaxation. the s(max) values decrease with increasing film thickness. the statistical analysis of the fracture strength data were achieved by weibull distribution function and the fracture origins were predicted.; zhangdi于2010-03-09批量导入; made available in dspace on 2010-03-09t02:11:52z (gmt). no. of bitstreams: 1 659.pdf: 524001 bytes, checksum: 715015eac2a88fb6dc74606361f74d5e (md5) previous issue date: 2008; ieee.; state key lab multi spectral informat proc technol.; chinese soc micro nano technol.; ctr micro & nano syst.; ieee nanotechnol council.; shenyang inst automat.; univ california.; ucla, ctr cell control.; global engn technol inst.; nanosurf ag, smart instruments nanosci & nanotechnol.; us army int technol ctr, pacific.; [zhou, wei; yang, jinling; sun, guosheng; liu, xingfang; yang, fuhua; li, jinmin] cas, inst semicond, beijing 100864, peoples r china
收录类别CPCI-S
会议主办者ieee.; state key lab multi spectral informat proc technol.; chinese soc micro nano technol.; ctr micro & nano syst.; ieee nanotechnol council.; shenyang inst automat.; univ california.; ucla, ctr cell control.; global engn technol inst.; nanosurf ag, smart instruments nanosci & nanotechnol.; us army int technol ctr, pacific.
会议录2008 3rd ieee international conference on nano/micro engineered and molecular systems
会议录出版者ieee ; 345 e 47th st, new york, ny 10017 usa
学科主题半导体材料
会议录出版地345 e 47th st, new york, ny 10017 usa
语种英语
ISBN号978-1-4244-1907-4
源URL[http://ir.semi.ac.cn/handle/172111/7772]  
专题半导体研究所_中国科学院半导体研究所(2009年前)
推荐引用方式
GB/T 7714
Zhou, W,Yang, JL,Sun, GS,et al. Fracture properties of silicon carbide thin films charcterized by bulge test of long membranes[C]. 见:3rd ieee international conference of nano/micro engineered and molecular systems. sanya, peoples r china. jan 06-09, 2008.

入库方式: OAI收割

来源:半导体研究所

浏览0
下载0
收藏0
其他版本

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。