Fabrication and characterization of TO packaged high-speed laser modules - art. no. 682407
文献类型：会议论文
| 作者 | Wen, JM ; Liu, Y ; Wang, X ; Yuan, HQ ; Xie, L ; Zhu, NH |
| 出版日期 | 2008 |
| 会议名称 | conference on semiconductor lasers and applications iii |
| 会议日期 | nov 12-13, 2007 |
| 会议地点 | beijing, peoples r china |
| 关键词 | equivalent circuits FP laser modules DFB laser modules VCSEL modules Through hole (TO) packaging |
| 页码 | 6824: 82407-82407 |
| 通讯作者 | zhu, nh, chinese acad sci, inst semicond, state key lab integrated optoelect, pob 912, beijing 100083, peoples r china. |
| 中文摘要 | various high-speed laser modules are fabricated by to-packaged processes, such as fp laser modules, dfb laser modules, and vcsel modules. furthermore,, the resonance among the circuit elements provides an approach to compensating the to packaging parasitics, and improving the frequency response of the devices. the detailed equivalent circuit model is established to investigate both the laser diode and packaging comprehensively. the small-signal modulation bandwidths of the to packaged fp laser, dfb laser and the vcsel modules are more than 10, 9.7 and 8 ghz, respectively. |
| 英文摘要 | various high-speed laser modules are fabricated by to-packaged processes, such as fp laser modules, dfb laser modules, and vcsel modules. furthermore,, the resonance among the circuit elements provides an approach to compensating the to packaging parasitics, and improving the frequency response of the devices. the detailed equivalent circuit model is established to investigate both the laser diode and packaging comprehensively. the small-signal modulation bandwidths of the to packaged fp laser, dfb laser and the vcsel modules are more than 10, 9.7 and 8 ghz, respectively.; zhangdi于2010-03-09批量导入; made available in dspace on 2010-03-09t02:11:58z (gmt). no. of bitstreams: 1 708.pdf: 167655 bytes, checksum: 71bd2cb95b5456e40c92c1f5f5692e9e (md5) previous issue date: 2008; spie.; chinese opt soc.; [wen, ji min; liu, yu; wang, xin; yuan, hai qing; xie, liang; zhu, ning hua] chinese acad sci, inst semicond, state key lab integrated optoelect, beijing 100083, peoples r china |
| 收录类别 | CPCI-S |
| 会议主办者 | spie.; chinese opt soc. |
| 会议录 | semiconductor lasers and applications iii
 |
| 会议录出版者 | spie-int soc optical engineering ; 1000 20th st, po box 10, bellingham, wa 98227-0010 usa |
| 学科主题 | 光电子学 |
| 会议录出版地 | 1000 20th st, po box 10, bellingham, wa 98227-0010 usa |
| 语种 | 英语 |
| ISSN号 | 0277-786x |
| ISBN号 | 978-0-8194-6999-1 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/7854]  |
| 专题 | 半导体研究所_中国科学院半导体研究所（2009年前） |
| 推荐引用方式 GB/T 7714 | Wen, JM,Liu, Y,Wang, X,et al. Fabrication and characterization of TO packaged high-speed laser modules - art. no. 682407[C]. 见:conference on semiconductor lasers and applications iii. beijing, peoples r china. nov 12-13, 2007. |
入库方式： OAI收割
来源：半导体研究所
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