Design and Fabrication of Low-microwave loss Coplannar Waveguide and precise V groove on Silicon Substrate for Optoelectronic Packaging - art. no. 601938
文献类型：会议论文
| 作者 | Yang, H ; Zhu, HL ; Xie, HY ; Zhao, LJ ; Zhou, F ; Wang, W |
| 出版日期 | 2005 |
| 会议名称 | conference on passive components and fiber-based devices ii |
| 会议日期 | nov 07-10, 2005 |
| 会议地点 | shanghai, peoples r china |
| 关键词 | coplanar waveguide (CPW) V groove low microwave loss passive coupling optoelectronic packaging |
| 页码 | pt 1 and 2 6019: u811-u818 part 1&2 |
| 通讯作者 | yang, h, chinese acad sci, inst semicond, natl res ctr optoelect technol, beijing 100083, peoples r china. |
| 中文摘要 | optoelectronic packaging has become a most important factor that influences the final performance and cost of the module. in this paper, low microwave loss coplanar waveguide(cpw) on high resistivity silicon(hrs) and precise v groove in silicon substrate were successfully fabricated. the microwave attenuation of the cpw made on hrs with the simple process is lower than 2 db/cm in the frequency range of 0 similar to 26ghz, and v groove has the accuracy in micro level and smooth surface. these two techniques built a good foundation for high frequency packaging and passive coupling of the optoelectronic devices. based on these two techniques, a simple high resistivity silicon substrate that integrated v groove and cpw for flip-chip packaging of lasers was completed. it set a good example for more complicate optoelectronic packaging. |
| 英文摘要 | optoelectronic packaging has become a most important factor that influences the final performance and cost of the module. in this paper, low microwave loss coplanar waveguide(cpw) on high resistivity silicon(hrs) and precise v groove in silicon substrate were successfully fabricated. the microwave attenuation of the cpw made on hrs with the simple process is lower than 2 db/cm in the frequency range of 0 similar to 26ghz, and v groove has the accuracy in micro level and smooth surface. these two techniques built a good foundation for high frequency packaging and passive coupling of the optoelectronic devices. based on these two techniques, a simple high resistivity silicon substrate that integrated v groove and cpw for flip-chip packaging of lasers was completed. it set a good example for more complicate optoelectronic packaging.; zhangdi于2010-03-29批量导入; made available in dspace on 2010-03-29t06:06:16z (gmt). no. of bitstreams: 1 2336.pdf: 309463 bytes, checksum: 4c2abf0947f9d168f1024cc91a84bc9a (md5) previous issue date: 2005; chinese acad sci, inst semicond, natl res ctr optoelect technol, beijing 100083, peoples r china |
| 收录类别 | CPCI-S |
| 会议录 | passive components and fiber-based devices ii丛书标题: proceedings of the society of photo-optical instrumentation engineers (spie)
 |
| 会议录出版者 | spie-int soc optical engineering ; 1000 20th st, po box 10, bellingham, wa 98227-0010 usa |
| 学科主题 | 光电子学 |
| 会议录出版地 | 1000 20th st, po box 10, bellingham, wa 98227-0010 usa |
| 语种 | 英语 |
| ISSN号 | 0277-786x |
| ISBN号 | 0-8194-6050-8 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/9908]  |
| 专题 | 半导体研究所_中国科学院半导体研究所（2009年前） |
| 推荐引用方式 GB/T 7714 | Yang, H,Zhu, HL,Xie, HY,et al. Design and Fabrication of Low-microwave loss Coplannar Waveguide and precise V groove on Silicon Substrate for Optoelectronic Packaging - art. no. 601938[C]. 见:conference on passive components and fiber-based devices ii. shanghai, peoples r china. nov 07-10, 2005. |
入库方式： OAI收割
来源：半导体研究所
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