Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity Si sensors/detectors
文献类型:会议论文
作者 | Li, Z (Li, Z.) ; Li, CJ (Li, C. J.) |
出版日期 | 2006 |
会议名称 | 11th conference on defects recognition imaging and physics in semiconductors |
会议日期 | sep 13-19, 2005 |
会议地点 | beijing, peoples r china |
关键词 | DLTS |
页码 | 9 (1-3): 283-287 |
通讯作者 | li, z, brookhaven natl lab, upton, ny 11973 usa. 电子邮箱地址: zhengl@bnl.gov |
中文摘要 | current-based microscopic defect analysis method such as current deep level transient spectroscopy (i-dlts) and thermally stimulated current have been developed over the years at brookhaven national laboratory (bnl) for the defect characterizations on heavily irradiated (phi(n) >= 10(13) n/cm(2)) high-resistivity (>= 2 k omega cm) si sensors/detectors. the conventional dlts method using a capacitance transient is not valid on heavily irradiated high-resistivity si sensors/detectors. a new optical filling method, using lasers with various wavelengths, has been applied, which is more efficient and suitable than the traditional voltage-pulse filling. optimum defect-filling schemes and conditions have been suggested for heavily irradiated high-resistivity si sensors/detectors. (c) 2006 published by elsevier ltd. |
英文摘要 | current-based microscopic defect analysis method such as current deep level transient spectroscopy (i-dlts) and thermally stimulated current have been developed over the years at brookhaven national laboratory (bnl) for the defect characterizations on heavily irradiated (phi(n) >= 10(13) n/cm(2)) high-resistivity (>= 2 k omega cm) si sensors/detectors. the conventional dlts method using a capacitance transient is not valid on heavily irradiated high-resistivity si sensors/detectors. a new optical filling method, using lasers with various wavelengths, has been applied, which is more efficient and suitable than the traditional voltage-pulse filling. optimum defect-filling schemes and conditions have been suggested for heavily irradiated high-resistivity si sensors/detectors. (c) 2006 published by elsevier ltd.; zhangdi于2010-03-29批量导入; zhangdi于2010-03-29批量导入; brookhaven natl lab, upton, ny 11973 usa; chinese acad sci, inst semicond, beijing 100083, peoples r china |
收录类别 | CPCI(ISTP) |
会议录 | materials science in semiconductor processing
![]() |
会议录出版者 | elsevier sci ltd ; the boulevard, langford lane, kidlington, oxford ox5 1gb, oxon, england |
学科主题 | 半导体器件 |
会议录出版地 | the boulevard, langford lane, kidlington, oxford ox5 1gb, oxon, england |
语种 | 英语 |
ISSN号 | 1369-8001 |
源URL | [http://ir.semi.ac.cn/handle/172111/10000] ![]() |
专题 | 半导体研究所_中国科学院半导体研究所(2009年前) |
推荐引用方式 GB/T 7714 | Li, Z ,Li, CJ . Development of current-based microscopic defect analysis method using optical filling techniques for the defect study on heavily irradiated high-resistivity Si sensors/detectors[C]. 见:11th conference on defects recognition imaging and physics in semiconductors. beijing, peoples r china. sep 13-19, 2005. |
入库方式: OAI收割
来源:半导体研究所
浏览0
下载0
收藏0
其他版本
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。