Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver
文献类型：专利
| 作者 | SASADA, NORIKO; NAOE, KAZUHIKO; SHIRAI, MASATAKA; ARIMOTO, HIDEO; TADA, SATOSHI |
| 专利号 | US20060076573A1 |
| 著作权人 | LUMENTUM JAPAN, INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver |
| 英文摘要 | A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device. |
| 公开日期 | 2006-04-13 |
| 申请日期 | 2005-11-18 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/43518]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LUMENTUM JAPAN, INC. |
| 推荐引用方式 GB/T 7714 | SASADA, NORIKO,NAOE, KAZUHIKO,SHIRAI, MASATAKA,et al. Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver. US20060076573A1. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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