Fabricating methods of photoelectric devices and package structures thereof
文献类型：专利
| 作者 | TSENG, WEN LIANG; CHEN, LUNG HSIN |
| 专利号 | US20090152665A1 |
| 著作权人 | ADVANCED OPTOELECTRONIC TECHNOLOGY INC. |
| 国家 | 美国 |
| 文献子类 | 发明申请 |
| 其他题名 | Fabricating methods of photoelectric devices and package structures thereof |
| 英文摘要 | The invention discloses a method for fabricating a photoelectric device. A ceramic substrate is first provided, and then a first patterned electrode and a second patterned electrode are formed on and underneath the surface of the ceramic substrate. A plurality of photoelectric devices is sequentially connected to the first electrode layer with a wire solder or a eutectic joint method. The encapsulation materials cover the each photoelectric die to prevent damaged from the external force or environment. Cutting the ceramic substrate along the spaces between the photoelectric dies forms a plurality of independent package units. |
| 公开日期 | 2009-06-18 |
| 申请日期 | 2008-12-11 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/43583]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ADVANCED OPTOELECTRONIC TECHNOLOGY INC. |
| 推荐引用方式 GB/T 7714 | TSENG, WEN LIANG,CHEN, LUNG HSIN. Fabricating methods of photoelectric devices and package structures thereof. US20090152665A1. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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