中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Semiconductor photonic element, method of fabricating the same, and semiconductor photonic device equipped therewith

文献类型:专利

作者YOKOYAMA, YOSHITAKA; KUDO, KOJI; TSUJI, MASAYOSHI
发表日期2001-11-27
专利号US6323507
著作权人NEC CORPORATION
国家美国
文献子类授权发明
其他题名Semiconductor photonic element, method of fabricating the same, and semiconductor photonic device equipped therewith
英文摘要A semiconductor photonic element is provided, which realize low threshold current and satisfactory characteristics in the high temperatures and/or high output operating condition. This element is comprised of (a) a semiconductor substrate; (b) a mesa structure formed on a first surface of the substrate to extend in a specific direction; the mesa structure including an active layer and a pair of p- and n-type cladding layers located respectively at top and bottom sides of the active layer, forming a double heterojunction; (c)a current-constricting structure for constricting an injection current formed at each side of the mesa structure to expose a top of the mesa structure from the current-constricting structure; the current-constricting structure comprising a first current-blocking part and a second current-blocking part; the first current-blocking part having a dielectric current-blocking layer that extends to the mesa structure; the dielectric current-blocking layer being contacted with top edges of the mesa structure; the second current-blocking part having a semiconductor current-blocking layer; and (d) a semiconductor burying layer formed to cover the mesa structure and the multilayer current-constricting structure; the semiconductor burying layer being contacted with the top of the mesa structure.
公开日期2001-11-27
申请日期2000-01-20
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/45947]  
专题半导体激光器专利数据库
作者单位NEC CORPORATION
推荐引用方式
GB/T 7714
YOKOYAMA, YOSHITAKA,KUDO, KOJI,TSUJI, MASAYOSHI. Semiconductor photonic element, method of fabricating the same, and semiconductor photonic device equipped therewith. US6323507. 2001-11-27.

入库方式: OAI收割

来源:西安光学精密机械研究所

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