中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Layered semiconductor laser having solder laminations and method of making same

文献类型:专利

作者SEKI, AKINORI; OHNISHI, TOYOKAZU; NAKANO, JIRO; SUGIYAMA, TAKAHIDE; TOMITA, KAZUYOSHI; KANO, HIROYUKI
发表日期1997-02-18
专利号US5604761
著作权人TOYOTA JIDOSHA KABUSHIKI KAISHA
国家美国
文献子类授权发明
其他题名Layered semiconductor laser having solder laminations and method of making same
英文摘要A semiconductor laser having a plurality of semiconductor laser chips laminated by solder layers which cause no interference with laser beams is provided. To this end, each of the semiconductor laser chips has a solder sump recess formed in the surface to be soldered at an end adjacent to a laser beam radiating surface and extending through portions of the chip except an active layer. This semiconductor laser is manufactured by a method comprising the steps of forming grooves in a surface of an epitaxial substrate along boundaries of semiconductor laser chip areas for defining laser beam radiating surfaces, each of the grooves extending through portions constituting the substrate except an active layer and having a bottom substantially parallel to the epitaxial substrate surface; cleaving the epitaxial substrate along the grooves to provide the semiconductor laser chips with laser beam radiating surfaces defined by the cleaved surfaces; and laminating the plurality of semiconductor laser chips one above another by soldering.
公开日期1997-02-18
申请日期1994-10-14
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/46139]  
专题半导体激光器专利数据库
作者单位TOYOTA JIDOSHA KABUSHIKI KAISHA
推荐引用方式
GB/T 7714
SEKI, AKINORI,OHNISHI, TOYOKAZU,NAKANO, JIRO,et al. Layered semiconductor laser having solder laminations and method of making same. US5604761. 1997-02-18.

入库方式: OAI收割

来源:西安光学精密机械研究所

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