Method for burn-in processing of optical transmitter arrays using a submount substrate
文献类型：专利
| 作者 | CHANG, JAMES; KANESHIRO, RONALD T.; THERISOD, STEFANO G. |
| 发表日期 | 2003-09-23 |
| 专利号 | US6623997 |
| 著作权人 | AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method for burn-in processing of optical transmitter arrays using a submount substrate |
| 英文摘要 | A submount substrate is used for the dual purposes of enabling simultaneous burn-in processing for a relatively large number of arrays of optical transmitters and enabling conventional dicing techniques to be used to form mounting-ready assemblies. In the preferred embodiment, the submount substrate is a silicon wafer that is specifically designed to provide connectivity between VCSEL arrays and burn-in equipment during the testing stage, but is also designed to be segmented and used in the final packaging stage. Because the submount is a silicon wafer, conventional integrated circuit fabrication techniques may be used to form conductive patterns that define array-receiving areas and that allow external circuitry to communicate with the various VCSEL arrays. |
| 公开日期 | 2003-09-23 |
| 申请日期 | 2000-12-15 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/46953]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD. |
| 推荐引用方式 GB/T 7714 | CHANG, JAMES,KANESHIRO, RONALD T.,THERISOD, STEFANO G.. Method for burn-in processing of optical transmitter arrays using a submount substrate. US6623997. 2003-09-23. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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