Laser diode assembly
文献类型：专利
| 作者 | LELL, ALFRED; TAUTZ, SOENKE; STRAUSS, UWE; VIERHEILIG, CLEMENS |
| 发表日期 | 2014-05-27 |
| 专利号 | US8737445 |
| 著作权人 | OSRAM OPTO SEMICONDUCTORS GMBH |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Laser diode assembly |
| 英文摘要 | A laser diode assembly includes a housing having a housing part and a mounting part, which is connected to the housing part and which extends away from the housing part along an extension direction. A laser diode chip is disposed on the mounting part. The laser diode chip has, on a substrate, semiconductor layers with an active layer for emitting light. The housing part and the mounting part have a main body composed of copper and at least the housing part is steel-sheathed. A first solder layer having a thickness of greater than or equal to 2 μm is arranged between the laser diode chip and the mounting part. The laser diode chip has a radiation coupling-out area, on which a crystalline protective layer is applied. |
| 公开日期 | 2014-05-27 |
| 申请日期 | 2013-04-04 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/47215]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OSRAM OPTO SEMICONDUCTORS GMBH |
| 推荐引用方式 GB/T 7714 | LELL, ALFRED,TAUTZ, SOENKE,STRAUSS, UWE,et al. Laser diode assembly. US8737445. 2014-05-27. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。