Scribe etch process for semiconductor laser chip manufacturing
文献类型：专利
| 作者 | ANSELM, KLAUS ALEXANDER; BIKKY, RAJESH; HU, STEPHEN; PICKRELL, GREG; SULTANA, NAHID; UM, JAE YOON; WONG, CHIA CHEN DAVID |
| 发表日期 | 2016-05-31 |
| 专利号 | US9356422 |
| 著作权人 | APPLIED OPTOELECTRONICS, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Scribe etch process for semiconductor laser chip manufacturing |
| 英文摘要 | An improved scribe etch process for semiconductor laser chip manufacturing is provided. A method to etch a scribe line on a semiconductor wafer generally includes: applying a mask layer to a surface of the wafer; photolithographically opening a window in the mask layer along the scribe line; etching a trench in the wafer using a chemical etchant that operates on the wafer through the window opening, wherein the chemical etchant selectively etches through crystal planes of the wafer to generate a V-groove profile associated with the trench; and cleaving the wafer along the etched trench associated with the scribe line through application of a force to one or more regions of the wafer. |
| 公开日期 | 2016-05-31 |
| 申请日期 | 2014-02-26 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/47568]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | APPLIED OPTOELECTRONICS, INC. |
| 推荐引用方式 GB/T 7714 | ANSELM, KLAUS ALEXANDER,BIKKY, RAJESH,HU, STEPHEN,et al. Scribe etch process for semiconductor laser chip manufacturing. US9356422. 2016-05-31. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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