Integrated electro-optical package and method of fabrication
文献类型：专利
| 作者 | LEBBY, MICHAEL S.; JIANG, WENBIN; JACHIMOWICZ, KAREN E. |
| 发表日期 | 2000-02-08 |
| 专利号 | US6022760 |
| 著作权人 | SEIKO EPSON CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Integrated electro-optical package and method of fabrication |
| 英文摘要 | An integrated electro-optical package including a dual sided opto-electronic device, composed of a substrate with an array of light emitting devices (LEDs) formed on a first major surface thereof, and at least one vertical cavity surface emitting laser formed on an opposed second major surface of the substrate. A mounting structure formed so as to allow for the mounting of the dual sided opto-electronic device on the interior major surfaces, and further having electrical conductors for cooperating with the LEDs and VCSEL of the opto-electronic device. A driver substrate having electrical connections for interfacing with the mounting structure and the dual sided opto-electronic device. A plurality of driver circuits connected to the mounting structure and dual sided opto-electronic device through connection pads formed on the driver substrate. |
| 公开日期 | 2000-02-08 |
| 申请日期 | 1998-07-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/49136]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SEIKO EPSON CORPORATION |
| 推荐引用方式 GB/T 7714 | LEBBY, MICHAEL S.,JIANG, WENBIN,JACHIMOWICZ, KAREN E.. Integrated electro-optical package and method of fabrication. US6022760. 2000-02-08. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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