Heat sink for semiconductor chip
文献类型：专利
| 作者 | FUKUZAKI IKUO; KATSUKI YOICHIRO |
| 发表日期 | 1990-11-30 |
| 专利号 | JP1990291155A |
| 著作权人 | OKI ELECTRIC IND CO LTD |
| 国家 | 日本 |
| 文献子类 | 发明申请 |
| 其他题名 | Heat sink for semiconductor chip |
| 英文摘要 | PURPOSE:To align a semiconductor chip with a heat sink easily and accurately by a method wherein a side face of a stepped part is made perpendicular to the surface of a main body part and the surface of the main body part is made parallel to the surface of the stepped part. CONSTITUTION:A heat sink 7 has a structure where the following have been installed: a rectangular-parallelepiped-shaped main body part 8; a rectangular- parallelepiped-shaped stepped part 9 which has been formed collectively with the main body part 8 and which protrudes from the surface of the main body part 8. When a semiconductor laser 10 is placed on the stepped part 9 and the semiconductor laser 10 is positioned, its positioning operation is executed by using two sides of the semiconductor laser 10 and two sides of the stepped part 9 of the heat sink 7. Thereby, a dislocation is hard to cause; the semiconductor laser 10 can be positioned easily and accurately. |
| 公开日期 | 1990-11-30 |
| 申请日期 | 1989-04-28 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/50555]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OKI ELECTRIC IND CO LTD |
| 推荐引用方式 GB/T 7714 | FUKUZAKI IKUO,KATSUKI YOICHIRO. Heat sink for semiconductor chip. JP1990291155A. 1990-11-30. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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